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RODA

SPECIALITY MANUFACTURE CCL

LOW DK & DF

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Details

LOW DK & DF

 

 

Low Loss&High Heat Resistance Material

 

特点            

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. 低Z轴膨胀系数,优异的通孔可靠性
  3. 低吸水率

应用领域            
通讯设备、网络设备、高频测量设备等

 

 FEATURES     

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. Lower Z-axis CTE , offering superior PTH reliability
  3. Lower moisture absorption

 APPLICATIONS     
Network equipment , High frequency measuring instruments etc.

 

GENERAL PROPERTIES    

Test ltem

Unit

Test Method

Treatment Condition

Property Data

SPEC

Typical Value

Thermal

Glass Transition
Temperature,Tg

DMA

A

>180

200

Thermal
Expansion,
Z-CTE

ppm/℃

IPC-TM-650
2.4.24

Before Tg

<60

45

After Tg

<260

210

50-260℃

<3.0

2.6

Decomposition Temperature,Td

IPC-TM-650
2.4.24.6
5%wt loss

A

>370

383

Delamination
Time,T288

Min

IPC-TM-650
2.4.24

A

>60

120

Delamination Time,T300

Min

IPC-TM-650
2.4.24

A

>30

60

Humidity
Resistant

Cycle

/

85℃/85%RH,168hr
288℃/10sec,Dipping

>3

>10

Dlelectrlc

Dielectric
Constant,(DK)

/

IPC-TM-650
2.5.5.9

1GHz

3.85

/

SPDR,RC55%

10GHz

4.05

Dissipation
Factor(Df)

/

IPC-TM-650
2.5.5.9

1GHz

0.0035

/

SPDR,RC55%

10GHz

0.0068

Physlcal

Peel Strength,
RTF/1OZ

IBS/IN

IPC-TM-650 2.4.8

288℃/10s

>4

5.8

Water Absorption

%

IPC-TM-650 2.6.2.1

\

<0.35

0.09

Flammability

/

UL94

A

V0

V-0(Br)

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

  Dielectric Constant and Disspation Factor

         

 

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.8mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

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