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RH150

Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment
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Product description
Parameters

RH150

RH150

 

(UL ANSI:FR-4.1)High Performance,Mid-Tg Halogen-free

 

FEATURES     

  1. Free of constituents such as halogen,animony,red phosphorous,ect。
  2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

APPLICATIONS     
Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

 

 FEATURES     

  1. Free of constituents such as halogen,animony,red phosphorous,ect。
  2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

 APPLICATIONS     
Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

IBS/IN

 

 

As received

A

≥8.0

10.8

After thermal stress

A

≥8.0

10.8

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥107

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

≥103

≥107

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.15

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

 

Mpa

 

 

Length direction

A

≥415

580

Cross direction

A

≥345

460

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

160

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.8

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.011

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

≥150

152

13.CTE(Z-axis)

Before Tg

PPM/℃

≤60

45

After Tg

PPM/℃

≤300

240

50-260℃

%

≤3.5

2.9

14.T260

TMA

min

≥30

60

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                               Warpage of                                                                               Warpage of

                              (No-treating)                                                                               (After treating:125℃ 2hr)

 RH150               RH150

                         Peel strength

          RH150

  ※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

Keyword:
minimum
temperature
defect
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Description:
白龙

JIANGSU RODA ELECTRON MATERIAL Co.,Ltd.

Add: No. 98, Yalujiang Road, Rudong Economic Development Zone
Fax: 86-513-84885522
Website: www.ccl-roda.com
E-mail: sales@ccl-roda.com

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