RL150
RL150

张家口RL150

RL150 (ULANSI: FR-4.0) Mid TgLead Free/UVBlocking Features Tg ≥ 150 ℃ Lead free compatible FR-4 board UVBlocking/AOI compatible Excellent mechanical processing performance Excellent CAF resistance Application areas FEATURES Tg ≥ 150 ℃ Lead freecompatibleFR-4b

类别：

张家口Lead-free compatible FR-4

电话:400-888-8888

询价

产品描述

nuode

RL150

 

 

(UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking

 

FEATURES            

  1. Tg ≥ 150 ℃ lead-free compatible FR-4 board
  2. UV Blocking/AOI Compatible
  3. Excellent machinability processability
  4. Excellent Anti-CAF Performance

Application field            
Computers, instruments, cameras, communication equipment,
Electronic game consoles, cars, etc.

 

 FEATURES     

  1. Tg ≥ 150 ℃ lead-free compatible FR-4 board
  2. UV Blocking/AOI Compatible
  3. Excellent machinability processability 
  4. Excellent Anti-CAF Performance

 APPLICATIONS     
Computer，lnstrumentation，VCR，communication equipment，electronic game machine，automotive electronics，and etc。

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

　

IBS/IN

　

　

As received

A

≥8.0

12.6

After thermal stress

A

≥8.0

12.6

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

MΩ

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.13

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

　

Mpa

　

　

Length direction

A

≥415

520

Cross direction

A

≥345

450

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

140

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

　

≤5.4

4.9

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.016

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

　

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

℃

≥150

152

13. CTI，V

TEC-112

V

≥175

200

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

　　                      Warpage of                                                                              Warpage of

　　                      (No-treating)                                                                             (After treating:125℃ 2hr)

nuode                                          nuode

　　                      Peel strength

                           

　　※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）   

※ Other sheet size and thickness could be available upon request.

 

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