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RD140

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Ordinary FR-4

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

RD140

 

 

(UL ANSI:FR-4.0) UV Blocking

 

Features           

  1. Tg140℃（DSC）
  2. UV Blocking/AOI compatible
  3. Excellent machining performance

Application field            
Computers, instruments, cameras, communication equipment,
Electronic game consoles, automobiles, aviation, etc.
Not suitable for applications with CAF requirements.

 

 FEATURES     

  1. Tg140℃（DSC）
  2. UV Blocking/AOI Compatible
  3. Excellent mechanical processability

 APPLICATIONS     
Computer，Instrumentation, VCR，communication equipment，electronic game machine，automotive electronics，aviation，and etc.
Not suitable for Anti-CAF application.

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

　

IBS/IN

　

　

As received

A

≥8.0

12.7

After thermal stress

A

≥8.0

12.7

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

MΩ

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.21

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

60

6. Flexural strength ,Minimum

　

Mpa

　

　

Length direction

A

≥415

550

Cross direction

A

≥345

450

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

120

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

　

≤5.4

4.6

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.020

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

　

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

℃

≥140

142

13. CTI，V

TEC-112

V

≥175

200

Note:
the treatment of letters and numerical meaning
    A - platse delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

　                   　    Warpage of                                                                                 Warpage of

　　                      (No-treating)                                                                                (After treating:125℃ 2hr)

123                                              123

　　                        Peel strength

                         123

　　※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.1mm  to  3.4mm

12μm  to    105μm

940×1245mm（37″×49″）  1041×1245mm（41″×49″）
1092×1245mm（43″×49″）    

※ Other sheet size and thickness could be available upon request.

 

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