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LOW DK & DF

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

LOW DK & DF

 

 

Low Loss&High Heat Resistance Material

 

FEATURES           

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. Lower Z-axis CTE , offering superior PTH reliability
  3. Lower moisture absorption

APPLICATIONS            
Network equipment , High frequency measuring instruments etc.

 

 FEATURES     

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. Lower Z-axis CTE , offering superior PTH reliability
  3. Lower moisture absorption

 APPLICATIONS     
Network equipment , High frequency measuring instruments etc.

 

GENERAL PROPERTIES    

Test ltem

Unit

Test Method

Treatment Condition

Property Data

SPEC

Typical Value

Thermal

Glass Transition
Temperature,Tg

DMA

A

>180

200

Thermal
Expansion,
Z-CTE

ppm/℃

IPC-TM-650
2.4.24

Before Tg

<60

45

After Tg

<260

210

50-260℃

<3.0

2.6

Decomposition Temperature,Td

IPC-TM-650
2.4.24.6
5%wt loss

A

>370

383

Delamination
Time,T288

Min

IPC-TM-650
2.4.24

A

>60

120

Delamination Time,T300

Min

IPC-TM-650
2.4.24

A

>30

60

Humidity
Resistant

Cycle

/

85℃/85%RH,168hr
288℃/10sec,Dipping

>3

>10

Dlelectrlc

Dielectric
Constant,(DK)

/

IPC-TM-650
2.5.5.9

1GHz

3.85

/

SPDR,RC55%

10GHz

4.05

Dissipation
Factor(Df)

/

IPC-TM-650
2.5.5.9

1GHz

0.0035

/

SPDR,RC55%

10GHz

0.0068

Physlcal

Peel Strength,
RTF/1OZ

IBS/IN

IPC-TM-650 2.4.8

288℃/10s

>4

5.8

Water Absorption

%

IPC-TM-650 2.6.2.1

\

<0.35

0.09

Flammability

/

UL94

A

V0

V-0(Br)

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

  Dielectric Constant and Disspation Factor

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PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.8mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

Cooperation Intent Form