LOW DK & DF
The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.
Category:
keyword:
Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking
DESCRIPTION
FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength
APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers
LOW DK & DF |
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Low Loss&High Heat Resistance Material |
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FEATURES
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APPLICATIONS |
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FEATURES
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APPLICATIONS |
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GENERAL PROPERTIES |
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Test ltem |
Unit |
Test Method |
Treatment Condition |
Property Data |
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SPEC |
Typical Value |
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Thermal |
Glass Transition |
℃ |
DMA |
A |
>180 |
200 |
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Thermal |
ppm/℃ |
IPC-TM-650 |
Before Tg |
<60 |
45 |
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After Tg |
<260 |
210 |
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50-260℃ |
<3.0 |
2.6 |
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Decomposition Temperature,Td |
℃ |
IPC-TM-650 |
A |
>370 |
383 |
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Delamination |
Min |
IPC-TM-650 |
A |
>60 |
120 |
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Delamination Time,T300 |
Min |
IPC-TM-650 |
A |
>30 |
60 |
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Humidity |
Cycle |
/ |
85℃/85%RH,168hr |
>3 |
>10 |
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Dlelectrlc |
Dielectric |
/ |
IPC-TM-650 |
1GHz |
3.85 |
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SPDR,RC55% |
10GHz |
4.05 |
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Dissipation |
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IPC-TM-650 |
1GHz |
0.0035 |
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SPDR,RC55% |
10GHz |
0.0068 |
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Physlcal |
Peel Strength, |
IBS/IN |
IPC-TM-650 2.4.8 |
288℃/10s |
>4 |
5.8 |
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Water Absorption |
% |
IPC-TM-650 2.6.2.1 |
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<0.35 |
0.09 |
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Flammability |
/ |
UL94 |
A |
V0 |
V-0(Br) |
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Note: |
Dielectric Constant and Disspation Factor
PURCHASING INFORMATION |
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Thickness |
Copper foil |
Standard Size |
0.8mm to 3.4mm |
12μm to 105μm |
1041×1245mm(41″×49″) 940×1245mm(37″×49″) |
※ Other sheet size and thickness could be available upon request. |
Cooperation Intent Form