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LOW DK & DF

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Low dielectric constant

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

LOW DK & DF

 

 

Low Loss&High Heat Resistance Material

 

FEATURES           

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. Lower Z-axis CTE , offering superior PTH reliability
  3. Lower moisture absorption

APPLICATIONS            
Network equipment , High frequency measuring instruments etc.

 

 FEATURES     

  1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
  2. Lower Z-axis CTE , offering superior PTH reliability
  3. Lower moisture absorption

 APPLICATIONS     
Network equipment , High frequency measuring instruments etc.

 

GENERAL PROPERTIES    

Test ltem

Unit

Test Method

Treatment Condition

Property Data

SPEC

Typical Value

Thermal

Glass Transition
Temperature,Tg

℃

DMA

A

＞180

200

Thermal
Expansion,
Z-CTE

ppm/℃

IPC-TM-650
2.4.24

Before Tg

＜60

45

After Tg

＜260

210

50-260℃

＜3.0

2.6

Decomposition Temperature,Td

℃

IPC-TM-650
2.4.24.6
5%wt loss

A

＞370

383

Delamination
Time,T288

Min

IPC-TM-650
2.4.24

A

＞60

120

Delamination Time,T300

Min

IPC-TM-650
2.4.24

A

＞30

60

Humidity
Resistant

Cycle

/

85℃/85%RH,168hr
288℃/10sec,Dipping

＞3

＞10

Dlelectrlc

Dielectric
Constant,(DK)

/

IPC-TM-650
2.5.5.9

1GHz

3.85

/

SPDR,RC55%

10GHz

4.05

Dissipation
Factor(Df)

/

IPC-TM-650
2.5.5.9

1GHz

0.0035

/

SPDR,RC55%

10GHz

0.0068

Physlcal

Peel Strength,
RTF/1OZ

IBS/IN

IPC-TM-650 2.4.8

288℃/10s

＞4

5.8

Water Absorption

%

IPC-TM-650 2.6.2.1

\

＜0.35

0.09

Flammability

/

UL94

A

V0

V-0(Br)

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

　　Dielectric Constant and Disspation Factor

nuode         nuode

 

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.8mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）    

※ Other sheet size and thickness could be available upon request.

 

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