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Metal base

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Metal base

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

Aluminum Base CCL

 

FEATURES            

  1. Superior Heat Dissipation
  2. High Peel Strength
  3. Excellent Thermal Reliability and Insulation Reliability
  4. Excellent Processability

APPLICATIONS            
Suitable for high-power LED lighting，power supply board，LED TV，and etc.

 

 FEATURES     

  1. Superior Heat Dissipation
  2. High Peel Strength
  3. Excellent Thermal Reliability and Insulation Reliability
  4. Excellent Processability

 APPLICATIONS     
Suitable for high-power LED lighting，power supply board，LED TV，and etc。

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Typical value

Peel Strength , LBS/IN,Minimum,1 OZ

288℃/10sec　

LBS/IN

11.7

Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥108

Surface resistivity , Minimum
At elevated temperature E-24/125      

 E-24/125

MΩ

≥108

Thermal Stress

288℃,solder dip

Min

10

288℃,solder float

Min

30

Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

6.0

Thermal Conductivity

Dielectric layer

ASTM D5470

W/(m﹒K)

2.0

Thermal Resistance

K﹒cm2/W

0.57

Dielectric Constant

C-24/23/50,1MHz

-

5.3

C-24/23/50,1GHz

-

5.1

Dissipation Factor

C-24/23/50,1MHz

-

0.022

C-24/23/50,1GHz

-

0.018

CTI

IEC60112 Method

V

200

Flammability

UL-94

-

V-0

Glass Transition Temperature

DSC

℃

140

CTE(Z-axis)

Before Tg

TMA

ppm/℃

27

Decomposition Temperature(Td)

TGA(5% Weight Loss)

℃

390

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath
    E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

　　Peel strength Reliability

  nuode

   ※Specimen T hickness:1.6mm single side board

 

PURCHASING INFORMATION    

 

 

Material

Type

Cu

E/D Cu

HOZ、1OZ、2OZ

Dielectric Layer

Epoxy resin filled with inorganic filler

75μm-120μm

Base Metal Plate

1060 Al

0.3mm-3.0mm

1100 Al

3003 Al

5052 Al

Masking Film

PET/PI Film

2.5mil

Standard Size

914mm×1219mm（36＂×48＂）；1016mm×1219mm（40＂×48＂）1000mm×1200mm； 500mm×600mm

※ Other sheet size and thickness could be available upon request.

 

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