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RD140T -Y0 PREPREG

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Prepreg

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

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DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

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RD140T -Y0  PREPREG

 

 

(UL ANSI:FR-4)Bonding Prepreg For RD140T

 

FEATURES            

  1. Tg150℃（DSC）
  2. UV Blocking/AOI Compatible
  3. Excellent bonding strength，wide

FEATURES     

  1. Tg150℃（DSC）
  2. UV Blocking/AOI Compatible
  3. Excellent bonding strength，wide

operating window

 

prepreg test method：

Designation

Class fabric type

Performance

Resin Content
（%）

Resin flow
（%）

Cured Thickness
(mil)

Gel time
(sec)

RD140T-Y0

7628

UV Blocking

42.0

21±5

7.0±0.5

130±20

43.0

22±5

7.3±0.5

 

45.0

23±5

7.9±0.5

 

2116

52.0

32±5

4.5±0.5

 

53.0

34±5

4.8±0.5

 

55.0

35±5

5.1±0.5

 

58.0

37±5

5.5±0.5

 

1080

62.0

35±5

2.7±0.5

 

65.0

38±5

3.1±0.5

 

Resin Contenr、Resin flow、Gel time：IPC-TM-650

RD140T-Y0 PREPREG HOT PRESSING CYCLE (REFERENCE)

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　　PREPREG STORAGE

　　STORAGE CONDITION：

  • Three months when stored at<23℃ and<50% RH。
  • Six months when stored at<5℃。Normalize in room temperature for at least 4h before using。
  • Beware of moisture，always keep wrapped in damp-proof material。Were kept in normal condition，prepregmight absorb moisture and its bonding strength would be weakened。
  • Avoid uv-rays and strong light。

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