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RL170

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Lead-free compatible FR-4

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

RL170
 

 

(UL ANSI:FR-4.0)High-Tg Lead-Free /UV Blocking

 

Features           

  1. Tg ≥170℃ lead-free compatible FR-4 sheet
  2. UV Blocking/AOI compatible
  3. Excellent machining performance
  4. Excellent CAF resistance

Application field            
Computers, communication equipment, automotive electronics, high-end instruments for industrial control, etc.

 

 FEATURES     

  1. Tg ≥ 170 ℃ lead-free compatible FR-4 board
  2. UV Blocking/AOI Compatible
  3. Excellent machinability processability
  4. Excellent Anti-CAF Performance

 APPLICATIONS     
Computer ,  communication equipment ,  automotive electronics , precise apparatus and instrument , and etc.

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

　

IBS/IN

　

　

As received

A

≥8.0

12.7

After thermal stress

A

≥8.0

12.7

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

MΩ

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.13

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

52

6. Flexural strength ,Minimum

　

Mpa

　

　

Length direction

A

≥415

550

Cross direction

A

≥345

480

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

120

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

　

≤5.4

4.7

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.016

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

　

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

℃

≥170

172

13. CTI，V

TEC-112

V

≥175

200

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

　　              Warpage of                                                                                                Warpage of

　　             (No-treating)                                                                                               (After treating:125℃ 2hr)

nuode                                                            nuode

　          　Peel strength

                 

　　※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）    

※ Other sheet size and thickness could be available upon request.

 

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