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RH150

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

Halogen-free compatible FR-4

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

RH150

 

(UL ANSI:FR-4.1)High Performance，Mid-Tg Halogen-free

 

FEATURES            

  1. Free of constituents such as halogen，animony，red phosphorous，ect.
  2. Excellent mechanical processibility and thermal resistance，lead free process compliancy.

APPLICATIONS            
Mobile phone，portable electronics，notebook and PC， QA equipment， communications，network equipment

 

 FEATURES     

  1. Free of constituents such as halogen，animony，red phosphorous，ect。
  2. Excellent mechanical processibility and thermal resistance，lead free process compliancy。

 APPLICATIONS     
Mobile phone，portable electronics，notebook and PC， QA equipment， communications，network equipment

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

　

IBS/IN

　

　

As received

A

≥8.0

10.8

After thermal stress

A

≥8.0

10.8

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥107

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

MΩ

≥103

≥107

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.15

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

　

Mpa

　

　

Length direction

A

≥415

580

Cross direction

A

≥345

460

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

160

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

　

≤5.4

4.8

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.011

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

　

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

℃

≥150

152

13.CTE(Z-axis)

Before Tg

PPM/℃

≤60

45

After Tg

PPM/℃

≤300

240

50-260℃

%

≤3.5

2.9

14.T260

TMA

min

≥30

60

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                               Warpage of                                                                               Warpage of

                              (No-treating)                                                                               (After treating:125℃ 2hr)

 nuode               nuode

　　                       Peel strength

          nuode

　　※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）    

※ Other sheet size and thickness could be available upon request.

 

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