产品展示
+
  • IMG_1718.jpg

CEM-3

The main electronic basic material for the production of communication equipment, digital home appliances, computers, and other products is copper foil substrate, providing customers with satisfactory product selection and after-sales service.

Category:

CEM-3

keyword:

 Ordinary FR-4 | Prepreg | Lead-free compatible FR-4 | High leakage tracking

Consultation BACK

DESCRIPTION

FEATURES
● Stable DK/DF performance
● Excellent performance of low loss and tight toleranceExcellent dimentional stability
● Excellent peel strength

 

APPLICATIONS
● Antenna of base stationPower Amplifier
● Satellite CommunicationsAutomotive Radar
● Filters, Couplers

nuode

CEM-3

 

 

(UL ANSI:CEM-3)

 

FEATURES            

  1. Punching process applicable，Longer drill bit life.
  2. Electrical properties equivalent to FR-4.
  3. Excellent PHT reliability equivalent to FR-4.

APPLICATIONS            
Apparatus and instrument，information household appliances，automotive electronics，remote control unit，game machine，and etc.

 

 FEATURES     

  1. Punching process applicable，Longer drill bit life.
  2. Electrical properties equivalent to FR-4.
  3. Excellent PHT reliability equivalent to FR-4.

 APPLICATIONS     
Apparatus and instrument，information household appliances，automotive electronics，remote control unit，game machine，and etc.

 

GENERAL PROPERTIES    

 Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

　

IBS/IN

　

　

As received

A

≥8.0

12.5

After thermal stress

A

≥8.0

12.5

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

MΩ

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.23

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

42

6. Flexural strength ,Minimum

　

Mpa

　

　

Length direction

A

≥276

390

Cross direction

A

≥186

320

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

115

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

　

≤5.4

4.6

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.02

11.Thermal stress 260℃,10sec( Minimum )                    

 

---

 

　

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

℃

≥135

136

13. CTI，V

TEC-112

V

≥175

200

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

 

　　                  Warpage of                                                                                       Warpage of

　                     (No-treating)                                                                                      (After treating:125℃ 2hr)

nuode                                                    nuode    

 

　　              Peel strength 

                   nuode

　　※Specimen T hickness:1.6mm single side board

 

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.8mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）   

※ Other sheet size and thickness could be available upon request.

 

Cooperation Intent Form

Submit